Method of reliably electroless-plating integrated circuit die
The present invention is a reliable method of electroless-plating integrated circuit die that achieves high yield. Die are attached to a holder using a polyimide adhesive to eliminate voltage differences on bond pads which would otherwise interfere with the plating. The die are aggressively cleaned using multiple cleaning solutions, one heated to a user-defined temperature. Each cleaning is followed by an aggressive rinse in de-ionized water. Die are immersed into multiple metal solutions at user-definable temperatures. Each immersion is followed by an aggressive rinse in de-ionized water, one with heated de-ionized water.
Inventors: Pal; Rathindra N. (Beltsville, MD), Berlin; Kingsley R. (Odenton, MD)
Assignee: The United States of America as represented by the National Security Agency (Washington, DC)
Appl. No.: 11/253,879
Filed: October 19, 2005